Custom silicon, shipped

From ingot to package, we own every layer.

A design house and fab partner running six process nodes under one roof — 28nm to 2nm risk production. Drag the die below and switch nodes to see what changes.

See the chips Tour the foundry

28nm Established

Drag to turn · tap a node to switch

Ingot to package

Seven steps, one roof.

Ingot

A 300mm cylinder of ultra-pure single-crystal silicon, grown by slowly pulling a seed crystal from a molten melt.

Wafer

The ingot is wire-sawn into wafers a fraction of a millimetre thick, then polished to a mirror finish flat to a few atoms.

Lithography

A mask pattern is projected onto photoresist across the wafer — EUV light for the finest layers, deep-UV for the rest.

Etch

Reactive plasma carves the exposed pattern into the wafer surface, layer by layer, hundreds of times per die.

Dope

Ion implantation embeds precise dopant atoms to define where each transistor turns on and off.

Package

Dies are diced, bonded to a substrate, wired or bumped, and sealed under a lid built for the thermal load.

Test

Every part is electrically tested and binned before it ever reaches a customer — nothing untested ships.

The full foundry tour →

Current lineup

What is shipping right now.

3nm · Frontier Onyx A1 Edge AI SoC 8 CPU + 16-core NPU · FCBGA-620 5nm · Dense Basalt X4 Server CPU 64 cores / 128 threads · LGA-4844 12nm · Balanced Talus M2 Industrial Microcontroller Dual-core, lockstep · QFN-48 7nm · Efficient Quartz RF2 RF Front-End Module N/A (RF) · WLCSP

See every chip →

One roof, six nodes

Small enough that the same engineer answers the RFQ and the escalation.

We run mature and frontier nodes side by side on purpose — most customers need one boring, reliable part and one that pushes density, not two different vendors.

6 process nodes in production

3 fabs, worldwide

98.4% line yield, trailing quarter

412 tapeouts shipped to date

Shop by node