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Basalt X4
In Production
A two-die chiplet part for the datacenter. 64 cores, one interposer, no single die large enough to tank your yield.
- Process node
- 5nm · Dense
- Category
- Server CPU
- Cores
- 64 cores / 128 threads
- Package
- LGA-4844
- Power
- 280W TDP
- Die size
- 612 mm² (2-die chiplet)
Datasheets are shared under NDA. Applications engineering typically responds within one business day.
About this part
Basalt is our answer to the reticle-limit problem: rather than one enormous 5nm die, it is two identical compute dies on a passive interposer, each independently tested and binned before assembly. A defect on one die doesn’t scrap the pair — it just changes which SKU it ships as.
64 cores and 128 threads at a 280W TDP is competitive with anything in its class, but the real pitch to customers is supply resilience: because each die is small and high-yielding, we can flex output faster than a monolithic competitor when demand spikes.
Qualified with three hyperscale customers; general availability now open to direct enterprise orders above 500 units.